Hi,
I am a thermal engineer working in a team which seeks to integrate TE0820 in our system.
I have seen the proposed cooling heatsink for the PCB (and specifically the UltraScale+ MPSoC).
Are you able to provide some thermal parameters for this cooling heatsink? For example a thermal resistance in units K/W or any thermal experiments results that you conducted to prove the cooling heatsink design.
My system works in 55 Celsius reaching a steady state so cooling the MPSoC is really an important part of the integration.
Thank you!