Hi,
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I have seen that the TE0808-04-09-1EE-S Starter Kit and TE0803-01-03-1EA-S share the same Carrier board so changing the incoming TE0803-01-03EG-1EA module with the TE0808-04-09EG-1EE: https://shop.trenz-electronic.de/en/TE0808-04-09EG-1EE-UltraSOM-MPSoC-Modul-with-Zynq-UltraScale-XCZU9EG-1FFVC900E-4-GB-DDR4 (https://shop.trenz-electronic.de/en/TE0808-04-09EG-1EE-UltraSOM-MPSoC-Modul-with-Zynq-UltraScale-XCZU9EG-1FFVC900E-4-GB-DDR4) would be enough right?
What do you mean with would be enough? This depends on your design. 09EG has more PL sources, than 03EG:
- https://www.xilinx.com/products/silicon-devices/soc/zynq-ultrascale-mpsoc.html#productTable
Basics are compatible between TE0808 and TE0803, so you can change module. But you must reconfigure PS with our settings --> GTP CLK REF are different for example. And you must change loc constrains of PL IOs. Design is the same, see reference Designs:
- https://wiki.trenz-electronic.de/display/PD/TE0803+StarterKit
- https://wiki.trenz-electronic.de/display/PD/TE0808+StarterKit
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Or I need the one with 2.5mm Samtec connector?
Stacking high is not so important (only for connector specification):
- https://wiki.trenz-electronic.de/pages/viewpage.action?pageId=36245987
But you must take use correct space holder.
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About the MBH31001-15W/2.6 heatsink, can I ask one module with this included?
MBH31001-15W/2.6 heatsink is standard BGA heatsink, i'm not sure if we sell them separately or connected on module only. You can write to our sales support: sales@trenz-electronic.de
br
John