Trenz Electronic GmbH Support Forum

Trenz Electronic Products => Trenz Electronic FPGA Modules => Topic started by: Francesco_Saitec on May 22, 2020, 12:01:47 PM

Title: TE0821 Carrier Design
Post by: Francesco_Saitec on May 22, 2020, 12:01:47 PM
Hello everyone,
I have to develop a carrier board for use with TE0821 SoM. I'm currently decide which supplies i need to. I take as reference design the TEF1002 carrier which provide 5V, 3V3 and 1V8 supplies to the module.
- Is it possible to supply the module with only 3V3 and 1V8 supplies? The EN6363QI mounted on SoM accept Vin from 2.7V to 6.6V.
- What is the power sequencing implemented by the MAX10 on TEF1002? I don't want to use a CPLD on my design so I want to recreate the sequencing made by the MAX10 via hardware.

Thanks in advance.
Title: Re: TE0821 Carrier Design
Post by: JH on May 25, 2020, 08:03:02 AM
Hi,
MAX10 Firmware description: https://wiki.trenz-electronic.de/display/PD/TEF1002+SC+CPLD+MAX10#TEF1002SCCPLDMAX10-PowerManagement

Single 3.3V for VIN in 3.3VIN is also possible, we do this on other carrier:
https://wiki.trenz-electronic.de/display/PD/4+x+5+SoM+Integration+Guide
--> TE0703 for example

Power sequencing is basically:
1 supply VIN and 3.3VIN
2 wait until 1.8VOUT or 3.3VOUT is available (use them to enable periphery regulators or use power switch)
3 supply  variable bank voltages and periphery.

See also FAQ(Power sequencing for variable IO banks and connected perihpery):
https://wiki.trenz-electronic.de/display/PD/FAQ#FAQ-PCBDesign

br
John